Blank Cover Image

Comparing the transient response of a resistive-type sensor with a thin film thermocouple during the post-exposure bake process

Author(s):
Kreider, K.G. ( National Institute of Standards and Technology (USA) )
DeWitt, D.P. ( National Institute of Standards and Technology (USA) )
Fowler, J.B. ( National Institute of Standards and Technology (USA) )
Proctor, J.E. ( Jeptech, Inc. (USA) )
Kimes, W.A. ( National Institute of Standards and Technology (USA) )
Ripple, D.C. ( National Institute of Standards and Technology (USA) )
Tsai, B.K. ( National Institute of Standards and Technology (USA) )
2 more
Publication title:
Data analysis and modeling for process control : 26-27 February 2004, Santa Clara, California, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5378
Pub. Year:
2004
Page(from):
81
Page(to):
92
Pages:
12
Pub. info.:
Bellingham, Wash., USA: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819452917 [0819452912]
Language:
English
Call no.:
P63600/5378
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Wafer Emissivity Effects on Light Pipe Radiometry in RTP Tools

Kreider, K.G., Chen, D.H., DeWitt, D.P., Kimes, W.A., Meyer, C.W., Tsai, B.K.

Electrochemical Society
7 Conference Proceedings Post exposure bake unit equipped with wafer-shape compensation technology

S. Goto, A. Morita, K. Oyama, S. Hori, K. Matsuchika, H. Taniguchi

SPIE - The International Society of Optical Engineering
2 Conference Proceedings RTP Calibration Wafer Using Thin-Film Thermocouples

Kreider, K. G., Dewitt, D. P., Tsai, B. K., Lovas, F. J., Allen, D. W.

MRS - Materials Research Society
8 Conference Proceedings Improving global CD uniformity by optimizing post-exposure bake and develop sequences

Osborne, S.P., Mueller, M., Lem, H., Reyland, D., Baik, K.H.

SPIE - The International Society of Optical Engineering
3 Conference Proceedings New models for the simulation of post-exposure bake of chemically amplifed resists

Matiut, D., Erdmann, A., Tollkuehn, B., Semmler, A.

SPIE-The International Society for Optical Engineering
9 Conference Proceedings A study of post-exposure baking effect for CAR process in photomask fabrication

Park, D.-I., Seo, S.-K., Jeong, W.-G., Park, E.-S., Lee, J.-H., Kwon, H.-J., Kim, J.-M., Jung, S.-M., Choi, S.-S.

SPIE-The International Society for Optical Engineering
4 Conference Proceedings Post soft-bake delay effect on CD variation in DUV resist

Tsai, S.-F., Chen, C.-Y., Chan, K.-T., Gao, H.-Y., Ku, C.-Y.

SPIE-The International Society for Optical Engineering
10 Conference Proceedings Acid Diffusion in Chemically Amplified Resists: The Effect of Prebaking and Post-Exposure Baking Temperature

Nakamura, Jiro, Ban, Hiroshi, Tanaka, Akinobu

American Chemical Society
5 Conference Proceedings Characterizing post-exposure bake processing for transient- and stedy-state conditions in the context of critical dimension control

Steele, D.A., Coniglio, A., Tang, C., Singh, B., Nip, S., Spanos, C.J.

SPIE-The International Society for Optical Engineering
11 Conference Proceedings Examination of a simplified reaction-diffusion model for post-exposure bake of chemically amplified resists

Smith,M.D., Mack,C.A.

SPIE-The International Society for Optical Engineering
6 Conference Proceedings Post-exposure bake kinetics in epoxy novolac-based chemically amplified resists

Argitis, P., Boyatzis, S., Raptis, I., Glezos, N., Hatzakis, M.

American Chemical Society
12 Conference Proceedings Modeling the impact of thermal history during post-exposure bake on the lithographic performance of chemically amplified resists

Smith,M.D., Mack,C.A., Petersen,J.S.

SPIE-The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12