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The impact of MEEF through pitch for 120-nm contact holes

Author(s):
Litt, L.C. ( Motorola (USA) )
Wu, W. ( Motorola (USA) )
Conley, W. ( Motorola (USA) )
Lucas, K.D. ( Motorola (USA) )
Roman, B.J. ( Motorola (USA) )
Montgomery, P. ( Motorola (USA) )
Kasprowicz, B.S. ( Photronics, Inc. (USA) )
Progler, C.J. ( Photronics, Inc. (USA) )
Socha, R.J. ( ASML (USA) )
Verhappen, A. ( ASML (Netherlands) )
Wampler, K.E. ( ASML (USA) )
Schaefer, E. ( ASML (USA) )
Cook, P. ( ASML (USA) )
Kuijten, J.-P. ( ASML (Netherlands) )
Pijnenburg, W. ( ASML (Netherlands) )
10 more
Publication title:
Optical Microlithography XVII
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5377
Pub. Year:
2004
Page(from):
1305
Page(to):
1314
Pages:
10
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819452900 [0819452904]
Language:
English
Call no.:
P63600/5377.2
Type:
Conference Proceedings

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