Total measurement uncertainty and total process precision evaluation of a structural metrology approach to monitoring post-CMP processes

Total measurement uncertainty and total process precision evaluation of a structural metrology approach to monitoring post-CMP processes

Author(s):

Lu, W. ( IBM Microelectronics Div. (USA) )
Archie, C.N. ( IBM Microelectronics Div. (USA) )
Stone, S. ( FEI Co. (USA) )
Kang, H.H. ( FEI Co. (USA) )
Chitturi, P.R. ( FEI Co. (USA) )

Publication title:

Metrology, Inspection, and Process Control for Microlithography XVIII

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5375

Pub. Year:

2004

Page(from):

503

Page(to):

514

Pages:

12

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819452887 [0819452882]

Language:

English

Call no.:

P63600/5375.1

Type:

Conference Proceedings

Details

TDL ID:	ZA00013723
Series ID:	PA00000029
Conf. info. (Name):	SPIE Advanced Lithography : Metrology, Inspection, and Process Control for Microlithography
Conf. info. (Number):	2004 : 18th
Conf. info. (Venue):	Santa Clara, CA, USA
Conf. info. (Date):	2004.02.23-2004.02.26

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