Packaging considerations for reliability of electrically controlled MEMS VOA

Packaging considerations for reliability of electrically controlled MEMS VOA

Author(s):

Lee, Y.G. ( Samsung Electro-Mechanics Co., Ltd. (South Korea) )
Hong, S.K. ( Samsung Electro-Mechanics Co., Ltd. (South Korea) )
Park, M.Y. ( Samsung Electro-Mechanics Co., Ltd. (South Korea) )
Jung, S.C. ( Samsung Electro-Mechanics Co., Ltd. (South Korea) )
Lee, S.H. ( Samsung Electro-Mechanics Co., Ltd. (South Korea) )

Publication title:

MOEMS and Miniaturized Systems IV

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5346

Pub. Year:

2004

Page(from):

160

Page(to):

165

Pages:

6

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819452542 [0819452548]

Language:

English

Call no.:

P63600/5346

Type:

Conference Proceedings

Details

TDL ID:	ZA00013690
Series ID:	PA00000029
Conf. info. (Name):	Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components : MOEMS and Miniaturized Systems
Conf. info. (Number):	2004 : 4th
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	2004.01.27-2004.01.28

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