Wafer-level scale package of MEMS device by eutectic bonding method
- Author(s):
Chen, S. ( Huazhong Univ. of Science and Technology (China) ) Ma, H. ( Huazhong Univ. of Science and Technology (China) ) Chen, M. ( Huazhong Univ. of Science and Technology (China) ) Xiong, T. ( Huazhong Univ. of Science and Technology (China) ) Liu, S. ( Huazhong Univ. of Science and Technology (China) ) Yi, X. ( Huazhong Univ. of Science and Technology (China) ) - Publication title:
- Reliability, Testing, and Characterization of MEMS/MOEMS III
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 5343
- Pub. Year:
- 2004
- Page(from):
- 94
- Page(to):
- 100
- Pages:
- 7
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819452511 [0819452513]
- Language:
- English
- Call no.:
- P63600/5343
- Type:
- Conference Proceedings
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