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Wafer-level scale package of MEMS device by eutectic bonding method

Author(s):
Chen, S. ( Huazhong Univ. of Science and Technology (China) )
Ma, H. ( Huazhong Univ. of Science and Technology (China) )
Chen, M. ( Huazhong Univ. of Science and Technology (China) )
Xiong, T. ( Huazhong Univ. of Science and Technology (China) )
Liu, S. ( Huazhong Univ. of Science and Technology (China) )
Yi, X. ( Huazhong Univ. of Science and Technology (China) )
1 more
Publication title:
Reliability, Testing, and Characterization of MEMS/MOEMS III
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5343
Pub. Year:
2004
Page(from):
94
Page(to):
100
Pages:
7
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819452511 [0819452513]
Language:
English
Call no.:
P63600/5343
Type:
Conference Proceedings

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