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Wafer-level vacuum packaging technology based on selective electroplating

Author(s):
Publication title:
Micromachining and Microfabrication Process Technology IX
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5342
Pub. date:
2004
Page(from):
26
Page(to):
34
Pages:
9
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819452504 [0819452505]
Language:
English
Call no.:
P63600/5342
Type:
Conference Proceedings

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