Micro hot embossing for high-aspect-ratio structure with materials flow enhancement by polymer sheet

Author(s):

• Murakoshi, Y. ( National Institute of Advanced Industrial Science and Technology (Japan) )
• Shan, X.-C. ( SIMTech (Singapore) )
• Sano, T. ( Chiba Institute of Technology (Japan) )
• Takahashi, M. ( National Institute of Advanced Industrial Science and Technology (Japan) )
• Maeda, R. ( National Institute of Advanced Industrial Science and Technology (Japan) )

Publication title:

Device and process technologies for MEMS, microelectronics, and photonics III : 10-12 December 2003, Perth, Australia

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5276

Pub. Year:

2004

Page(from):

532

Page(to):

539

Pages:

8

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819451699 [081945169X]

Language:

English

Call no.:

P63600/5276

Type:

Conference Proceedings