AC-coupled interconnect for high-density high-bandwidth packaging
- Author(s):
- Franzon, P.D. ( North Carolina State Univ. (USA) )
- Mick, S. ( North Carolina State Univ. (USA) )
- Wilson, J.M. ( North Carolina State Univ. (USA) )
- Luo, L. ( North Carolina State Univ. (USA) )
- Chandrasakhar, K. ( North Carolina State Univ. (USA) )
- Publication title:
- Microelectronics: Design, Technology, and Packaging
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 5274
- Pub. Year:
- 2004
- Page(from):
- 67
- Page(to):
- 69
- Pages:
- 3
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819451675 [0819451673]
- Language:
- English
- Call no.:
- P63600/5274
- Type:
- Conference Proceedings
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