Smart sensor application in teleoperated microassembly systems

Smart sensor application in teleoperated microassembly systems

Author(s):

Schilp, J. ( Technische Univ. Muenchen (Germany) )
Ehrenstrasser, M. ( Technische Univ. Muenchen (Germany) )
Clarke, S. ( Technische Univ. Muenchen (Germany) )
Petzold, B. ( Technische Univ. Muenchen (Germany) )
Zaeh, M.F. ( Technische Univ. Muenchen (Germany) )

Publication title:

Intelligent Manufacturing

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5263

Pub. Year:

2004

Page(from):

38

Page(to):

49

Pages:

12

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819451569 [0819451568]

Language:

English

Call no.:

P63600/5263

Type:

Conference Proceedings

Details

TDL ID:	ZA00013608
Series ID:	PA00000029
Conf. info. (Name):	Photonics East : Intelligent Manufacturing
Conf. info. (Number):	2003
Conf. info. (Venue):	Providence, RI, USA
Conf. info. (Date):	2003.10.29-2003.10.30

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