Modeling thermal reflow of resist contact hole arrays

Modeling thermal reflow of resist contact hole arrays

Author(s):

Lee, J.-W. ( Univ. of Wisconsin/Madison (USA) )
Feng, Z. ( Univ. of Wisconsin/Madison (USA) )
Engelstad, R.L. ( Univ. of Wisconsin/Madison (USA) )
Lovell, E.G. ( Univ. of Wisconsin/Madison (USA) )

Publication title:

23rd Annual BACUS Symposium on Photomask Technology

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5256

Pub. Year:

2003

Page(from):

1045

Page(to):

1056

Pages:

12

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819451439 [0819451436]

Language:

English

Call no.:

P63600/5256.2

Type:

Conference Proceedings

Details

TDL ID:	ZA00013601
Series ID:	PA00000029
Conf. info. (Name):	SPIE Photomask Technology : Annual BACUS Symposium on Photomask Technology
Conf. info. (Number):	2003 : 23rd
Conf. info. (Venue):	Monterey, California, USA
Conf. info. (Date):	2003.09.09-2003.09.12

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