Mask challenges and capability development for the 65-nm device technology node: the first status report
- Author(s):
Kim, W.D. ( Texas Instruments Inc. (USA) ) Aquino, C.M. ( KLA-Tencor Corp. (USA) ) Eickhoff, M.D. ( KLA-Tencor Corp. (USA) ) Lim, P. ( KLA-Tencor Corp. (USA) ) Fukuhara, N. ( Toppan Printing Co., Ltd. (Japan) ) Jessen, S.W. ( Texas Instruments Inc. (USA) ) Kikuchi, Y. ( Toppan Printing Co., Ltd. (Japan) ) Tanzawa, J. ( Toppan Printing Co., Ltd. (Japan) ) - Publication title:
- 23rd Annual BACUS Symposium on Photomask Technology
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 5256
- Pub. Year:
- 2003
- Page(from):
- 859
- Page(to):
- 870
- Pages:
- 12
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819451439 [0819451436]
- Language:
- English
- Call no.:
- P63600/5256.2
- Type:
- Conference Proceedings
Similar Items:
1
Conference Proceedings
Mask inspection challenges for 90- and 130-nm device technology nodes: inspection sensitivity and printability study using SEMI standard programmed defect masks
SPIE-The International Society for Optical Engineering |
7
Conference Proceedings
Post Cu-CMP Engineering Challenges for the 65 nm Technology Nodes and Beyond
Electrochemical Society |
2
Conference Proceedings
Advanced reticle inspection challenges and solutions for 65nm node [5992-12]
SPIE - The International Society of Optical Engineering |
SPIE-The International Society for Optical Engineering |
3
Conference Proceedings
Wafer FAB experience of implementing 50-Vk vector e-beam mask writer and bry etch process for 130-nm technology node generation
SPIE-The International Society for Optical Engineering |
9
Conference Proceedings
First review of a suitable metrology framework for the 65-nm technology node
SPIE-The International Society for Optical Engineering |
4
Conference Proceedings
Required mask specification for mass production devices below 65-nm design node [6349-81]
SPIE - The International Society of Optical Engineering |
SPIE-The International Society for Optical Engineering |
5
Conference Proceedings
Aerial image degradation effects due to imperfect sidewall profiles of EAPSM mask for 130-nm device node: 3D EMF simulations and wafer printing results
SPIE-The International Society for Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |