Reaction Bonding of Microstructured Silicon Carbide using Polymer and Silicon Thin Film

Reaction Bonding of Microstructured Silicon Carbide using Polymer and Silicon Thin Film

Author(s):

Publication title:

Silicon carbide and related materials 2003 : ICSCRM, 2003 : proceedings of the 10th International Conference on Silicon Carbide and Related Materials 2003, Lyon, France, October 5-10, 2003

Title of ser.:

Materials science forum

Ser. no.:

457-460

Pub. Year:

2004

Page(from):

1527

Page(to):

1530

Pages:

4

Pub. info.:

Uetikon-Zuerich: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878499434 [0878499431]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00013364
Series ID:	PA00000012
Conf. info. (Name):	ICSCRM : Intenational Conference on Silicon Carbide and Related Materials
Conf. info. (Number):	2003 : 10th
Conf. info. (Venue):	Lyon, France
Conf. info. (Date):	2003.10.05-2003.10.10

Similar Items:

1 Conference Proceedings Thermodynamics and Microstructure Development in the Thin Film Reaction of Aluminum on Silicon Carbide Hayes, T. S., Ray, F. T., Trumble, K. P., Kvam, E. P. MRS - Materials Research Society	7 Conference Proceedings NT-SiC (new-technology silicon carbide): c1 650mm optical space mirror substrate of high- strength reaction-sintered silicon carbide [5868-14] Suyama, S., Itoh, Y., Tsuno, K., Ohno, K. SPIE - The International Society of Optical Engineering
2 Conference Proceedings NTSIC (new technology silicon carbide): evaluation of microstructure of high-strength reaction-sintered silicon carbide for optical mirror S. Suyama, Y. Itoh Society of Photo-optical Instrumentation Engineers	8 Conference Proceedings Theoretical Optimization of Al-CVD using Elementary Reaction Simulation Sugiyama, M., Iino, T., Nakajima, T., Tanaka, T., Itoh, H., Aoyama, J., Egashira, Y., Yamashita, K., Komiyama, H., … Electrochemical Society
3 Conference Proceedings Delamination of Thin Layers in H+ Implanted Silicon Carbide Hara,T., Kakizaki,Y., Tanaka,H., Inoue,M., Kajiyama,K., Yoneda,T., Sekine,K., Masao,K. Trans Tech Publications	9 Conference Proceedings Improvements of apatite-forming abilities on pure and sodium-containing diopside substrates using porous diopside thin films as nucleating agent Iwata, N. Y., Tsunakawa, S., Tanaka, M., Utsu, T., Matsumoto, K. MRS-Materials Research Society
4 Conference Proceedings Characteristics of Thick Sol-Gel Lead Zirconate Titanate Films for Angular Rate Sensor Application Lee, S.H., Iijima, T., Nakamura, K., Tanaka, S., Esashi, M. Materials Research Society	10 Conference Proceedings Thin films in silicon carbide semiconductor devices (Invited Paper) Ostling, M., Koo, S.-M., Lee, S.-K., Zetterling, C.-M., Grishin, A. SPIE - The International Society of Optical Engineering
5 Conference Proceedings Die Bonding Issues on Silicon Carbide Diodes Lee, S.Y., Lee, J.S., Kim, T.H., Choi, S.Y., Kim, H.J., Bahng, W., Kim, N.K., Lee, S.K. Trans Tech Publications	11 Conference Proceedings Wafer Bonding Using Dielectric Polymer Thin Films in 3D Integration Kwon, Y., Lu, J.-Q., Kraft, R.P., McDonald, J.F., Gutmann, R.J., Cale, T.S. Materials Research Society
6 Conference Proceedings Elementary Reaction Simulation of Al-CVD Using Dimethyl Aluminum Hydride Sugiyama, M., Nakajima, T., Tanaka, T., Itoh, H., Aoyama, J., Egashira, Y., Yamashita, K., Komiyama, H., Shimogaki, Y. Electrochemical Society	12 Conference Proceedings COMPLEX MICROMECHANICAL STRUCTURES BY LOW TEMPERATURE BONDING M. Esashi Electrochemical Society

1

2

3

4

5

6

7

8

9

10

11

12