Growth Kinetics of IMC Formed between Sn-3.5Ag-0.75Cu BGA Solder and Electroless Ni-P/Cu Substrate by Solid-State Isothermal Aging

Growth Kinetics of IMC Formed between Sn-3.5Ag-0.75Cu BGA Solder and Electroless Ni-P/Cu Substrate by Solid-State Isothermal Aging

Author(s):

Publication title:

Designing, processing and properties of advanced engineering materials : proceedings of the 3rd International Symposium on Designing, Processing and Properties of Advanced Engineering Materials, held in Jeju, Korea, November 5-8, 2003

Title of ser.:

Materials science forum

Ser. no.:

449-452

Pub. Year:

2004

Page(from):

893

Page(to):

896

Pages:

4

Pub. info.:

Zuerich: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878499397 [0878499393]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00013360
Series ID:	PA00000012
Conf. info. (Name):	International Symposium on Designing, Processing and Properties of Advanced Engineering Materials
Conf. info. (Number):	3rd
Conf. info. (Venue):	Jeju, Korea
Conf. info. (Date):	2003.11.05-2003.11.08

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