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Characteristics of the Electroless-Deposited Cu Film as Interconnect on a TaN Diffusion Barrier

Author(s):
Kim, J.S.  
Publication title:
Designing, processing and properties of advanced engineering materials : proceedings of the 3rd International Symposium on Designing, Processing and Properties of Advanced Engineering Materials, held in Jeju, Korea, November 5-8, 2003
Title of ser.:
Materials science forum
Ser. no.:
449-452
Pub. Year:
2004
Page(from):
681
Page(to):
684
Pages:
4
Pub. info.:
Zuerich: Trans Tech Publications
ISSN:
02555476
ISBN:
9780878499397 [0878499393]
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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