Deposition of Copper Thin Films on Titanium Nitride Layer Prepared by Flow Modulation CVD Technology

Deposition of Copper Thin Films on Titanium Nitride Layer Prepared by Flow Modulation CVD Technology

Author(s):

Cho, N.I.

Publication title:

Designing, processing and properties of advanced engineering materials : proceedings of the 3rd International Symposium on Designing, Processing and Properties of Advanced Engineering Materials, held in Jeju, Korea, November 5-8, 2003

Title of ser.:

Materials science forum

Ser. no.:

449-452

Pub. Year:

2004

Page(from):

457

Page(to):

460

Pages:

4

Pub. info.:

Zuerich: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878499397 [0878499393]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00013359
Series ID:	PA00000012
Conf. info. (Name):	International Symposium on Designing, Processing and Properties of Advanced Engineering Materials
Conf. info. (Number):	3rd
Conf. info. (Venue):	Jeju, Korea
Conf. info. (Date):	2003.11.05-2003.11.08

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