Blank Cover Image

A Study on Interfacial Reaction between Electroless Plated Ni-P/Au UBM and Sn-Bi Eutectic Solder Using AEM

Author(s):
Publication title:
Designing, processing and properties of advanced engineering materials : proceedings of the 3rd International Symposium on Designing, Processing and Properties of Advanced Engineering Materials, held in Jeju, Korea, November 5-8, 2003
Title of ser.:
Materials science forum
Ser. no.:
449-452
Pub. date:
2004
Page(from):
405
Page(to):
408
Pages:
4
Pub. info.:
Zuerich: Trans Tech Publications
ISSN:
02555476
ISBN:
9780878499397 [0878499393]
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

Similar Items:

Kang, H.B., Choi, J.K., Lee, J.W., Yang, C.W.

Trans Tech Publications

Yoon, J. W., Kim, S. W., Jung, S. B.

Trans Tech Publications

Choi, J.W., Hong, S.J., Hwang, G.H., Kang, S.G.

Trans Tech Publications

Kim, J.W., Jung, S.B.

Trans Tech Publications

Kim, D.G., Ha, S.S., Jung, S.B.

Trans Tech Publications

Moon, J.K., Kang, K.I., Jung, J.P., Lee, J.S., Zhou, Y.

Society of Manufacturing Engineers

Kim, J.W., Yoon, J.W., Jung, S.B.

Trans Tech Publications

Choi, J.H., Jung, B.Y., Jun, S.W., Kim, Y.H., Oh, T.S.

Trans Tech Publications

K.I. Kang, J.P. Jung, W.H. Bang, J.H. Park, K.H. Oh

Trans Tech Publications

Choi, H.-J., Kim, H.-Y., Ko, D.-H., Ku, J.-H., Choi, C.-J., Choi, S., Fujihara, K., Kang, H.K., Yang, M-H., Yang, C.-W.

Electrochemical Society

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12