Reaction between Sn-In Solder and Under Bump Metallurgy

Reaction between Sn-In Solder and Under Bump Metallurgy

Author(s):

Publication title:

Designing, processing and properties of advanced engineering materials : proceedings of the 3rd International Symposium on Designing, Processing and Properties of Advanced Engineering Materials, held in Jeju, Korea, November 5-8, 2003

Title of ser.:

Materials science forum

Ser. no.:

449-452

Pub. Year:

2004

Page(from):

401

Page(to):

404

Pages:

4

Pub. info.:

Zuerich: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878499397 [0878499393]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00013359
Series ID:	PA00000012
Conf. info. (Name):	International Symposium on Designing, Processing and Properties of Advanced Engineering Materials
Conf. info. (Number):	3rd
Conf. info. (Venue):	Jeju, Korea
Conf. info. (Date):	2003.11.05-2003.11.08

Similar Items:

1 Conference Proceedings Growth Kinetics of Intermetallic Compound and Interfacial Reactions in Pb-Free Flip Chip Solder Bump during Solid State Isothermal Aging Kim, D. G., Jang, H. S., Kim, Y. J., Jung, S. B. Trans Tech Publications	7 Conference Proceedings Homoepitaxial growth of InGaN/GaN double-heterostructure light-emitting diode by low-pressure MOCVD Choi,Y.H., Kim,S.W., Yi,J.H., Yoo,T.-K, Hong,C.H., Kim,S.T. SPIE-The International Society for Optical Engineering
2 Conference Proceedings Bending Fatigue Characteristic of Sn-3.5Ag Solder Bump on Ni-UBM K.I. Kang, J.P. Jung, W.H. Bang, J.H. Park, K.H. Oh Trans Tech Publications	8 Conference Proceedings Thermodynamic Issues of Lead-Free Soldering in Electronic Packaging Jeong, S.W., Kim, J.H., Lee, H.M. Trans Tech Publications
3 Conference Proceedings *ADHESION, REACTION AND STABILITY OF METAL/POLYIMIDE INTERFACES Kim, J., Kowalczyk, S.P., Kim, Y.H., Chou, N.J., Oh, T.S. Materials Research Society	9 Conference Proceedings A Study on Interfacial Reaction between Electroless Plated Ni-P/Au UBM and Sn-Bi Eutectic Solder Using AEM Choi, J.K., Kang, H.B., Lee, J.W., Jung, S.B., Yang, C.W. Trans Tech Publications
4 Conference Proceedings Texture Evolution in Ni Substrate Prepared by Powder Metallurgy and Casting Methods J.H. Lim, K.T. Kim, E.C. Park, J.H. Joo, H.S. Kim, H.J. Lee, S.B. Jung, W.S. Nah Trans Tech Publications	10 Conference Proceedings Under-Gate Triode Type Field Emission Displays With Carbon Nanotube Emitters Kang, J.H., Choi, Y.S., Lee, N.S., Park, J., Choi, J.H., Choi, W.B., Kim, H.Y., Lee, Y.J., Chung, D.S., Jin, Y.W., You, … Materials Research Society
5 Conference Proceedings Ferroelectric Characteristics of SrxBi2.4Ta2O9 Thin Films and Electrical Properties of the Pt/SrxBi2.4Ta2O9/TiO2/Si Structure Choi, J.H., Oh, T.S. Trans Tech Publications	11 Conference Proceedings Two-frequency phase-shifting projection moire topography Kim,S.-W., Oh,J.-T., Jung,M.-S., Choi,Y.-B. SPIE - The International Society for Optical Engineering
6 Conference Proceedings Characteristics of ZnO Thin Film by Atomic Layer Deposition for Film Bulk Acoustic Resonator Kim, S.G., Jung, S.B., Oh, J.H., Kim, H.J., Shin, Y.H. Trans Tech Publications	12 Conference Proceedings Interfacial Reaction and Joint Strength on Cu UBM with Pb-Free Flip Chip Solder Bumps Kim, D.G., Ha, S.S., Jung, S.B. Trans Tech Publications

1

2

3

4

5

6

7

8

9

10

11

12