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Non-Destructive SiC Wafer Evaluation Based on an Optical Stress Technique

Author(s):
Publication title:
Silicon carbide and related materials 2002 : ECSCRM2002, proceedings of the 4th European Conference on Silicon Carbide and Related Materials, September 2-5, 2002, Linköping, Sweden
Title of ser.:
Materials science forum
Ser. no.:
433-436
Pub. date:
2003
Page(from):
361
Page(to):
364
Pages:
4
Pub. info.:
Zuerich, Switzerland: Trans Tech Publications
ISSN:
02555476
ISBN:
9780878499205 [0878499202]
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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