Thermal Stress Simulation in TiB2-Cu Functionally Graded Materials

Thermal Stress Simulation in TiB2-Cu Functionally Graded Materials

Author(s):

Publication title:

Functionally graded materials VII : proceedings of the seventh International Symposium on Functionally Graded Materials (FGM 2002), Beijing, China, October 15-18, 2002

Title of ser.:

Materials science forum

Ser. no.:

423-425

Pub. Year:

2003

Page(from):

245

Page(to):

248

Pages:

4

Pub. info.:

Uetikon-Zuerich, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878499151 [0878499156]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00013345
Series ID:	PA00000012
Conf. info. (Name):	FGM : International Symposium on Functionally Graded Materials
Conf. info. (Number):	2002 : 7th
Conf. info. (Venue):	Beijing, China
Conf. info. (Date):	2002.10.15-2002.10.18

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