Texture Analysis of Copper Bonding Wire

Texture Analysis of Copper Bonding Wire

Author(s):

Baeck, S.M.

Publication title:

Textures of materials : ICOTOM 13 : proceedings of the 13th International Conference on Textures of Materials, Seoul, Korea, August 26-30, 2002

Title of ser.:

Materials science forum

Ser. no.:

408-412

Pub. Year:

2002

Page(from):

803

Page(to):

808

Pages:

6

Pub. info.:

Uetikon-Zuerich, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878499038 [0878499032]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00013338
Series ID:	PA00000012
Conf. info. (Name):	International Conference on Textures of Materials - ICOTOM
Conf. info. (Number):	13th
Conf. info. (Venue):	Seoul, Korea
Conf. info. (Date):	2002.08.26-2002.08.30

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