Characterization of Cold Drawn Gold bonding Wire with EBSD
- Author(s):
Cho, J.-H. Cho, J.S. Moon, J.T. Lee, J. Cho, Y.H. Rollett, A.D. Oh, K.H. - Publication title:
- Textures of materials : ICOTOM 13 : proceedings of the 13th International Conference on Textures of Materials, Seoul, Korea, August 26-30, 2002
- Title of ser.:
- Materials science forum
- Ser. no.:
- 408-412
- Pub. Year:
- 2002
- Page(from):
- 499
- Page(to):
- 504
- Pages:
- 6
- Pub. info.:
- Uetikon-Zuerich, Switzerland: Trans Tech Publications
- ISSN:
- 02555476
- ISBN:
- 9780878499038 [0878499032]
- Language:
- English
- Call no.:
- M23650
- Type:
- Conference Proceedings
Similar Items:
Trans Tech Publications |
7
Conference Proceedings
EBSD Analysis of Grain Boundary Characteristics of Abnormally Grain Grown Alumina
Trans Tech Publications |
2
Conference Proceedings
The Microstructure Evolution of Copper and Gold Bonding Wires during Annealing
Trans Tech Publications |
8
Conference Proceedings
Cross-Sectional Crystallographic Analysis of Copper Electrodeposits for ULSI Metallization by EBSD
Electrochemical Society |
Trans Tech Publications |
9
Conference Proceedings
Texture and Microstructure Evolution during Cold Rolling of Cu-Fe Laminates Prepared by Accumulative Roll Bonding
Trans Tech Publications |
Trans Tech Publications |
10
Conference Proceedings
Monte Carlo Modelling of Recrystallization Mechanisms in Wire-Drawn Copper from EBSD Data
Trans Tech Publications |
Trans Tech Publications |
11
Conference Proceedings
Texture and Microstructure Evolution of Gold Sheet during Deformation and Annealing
Trans Tech Publications |
Trans Tech Publications |
Trans Tech Publications |