QuaSiC Smart-Cut Substrates for SiC High Power Devices

Silicon carbide and related materials 2001 : ICSCRM2001, proceedings of the International Conference on Silicon Carbide and Related Materials 2001, Tsukuba, Japan, October 28-November 2, 2001

Title of ser.:

Materials science forum

Ser. no.:

389-393

Pub. Year:

2002

Page(from):

151

Page(to):

154

Pages:

4

Pub. info.:

Zuerich, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878498949 [087849894X]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00013330
Series ID:	PA00000012
Conf. info. (Name):	International Conference on Silicon Carbide and Related Materials
Conf. info. (Number):	2001
Conf. info. (Venue):	Tsukuba, Japan
Conf. info. (Date):	2001.10.28-2001.11.02

Similar Items:

1 Conference Proceedings QuaSiC Smart-Cut Substrates for SiC High Power Devices Letertre, F., Jalaguier, E., Di Cioccio, L., Templier, F., Bluet, J.M., Banc, C., Matko, I., Chenevier, B., Bano, E., … Trans Tech Publications	7 Conference Proceedings New SiC on insulator wafers based on the Smart-Cut approach and their potential applications Joly, J.P., Aspar, B., Bruel, M., Di Cioccio, L., Letertre, F., Hugonnard-Bruyere, E. Kluwer Academic Publishers
2 Conference Proceedings SiC Power Devices on QUASIC and SiCOI Smart-CutR Substrates: First Demonstrations Letertre, F., Daval, N., Templier, F., Bano, E., Planson, D., Di Cioccio, L., Jalaguier, E., Bluet, J.M., Billon, T., … Trans Tech Publications	8 Conference Proceedings nnovative Substrate Solutions for Wide Band Gap Materials: the Smart CutTM Approach Letertre, F., Daval, N., Templier, F., DiCioccic, L., Richtarch, C., Faure, B., Cartier, A.M., Matko, I. Electrochemical Society
3 Conference Proceedings Epitaxial Growth on Metal Bonded SiC Substrates: Transmission Electron Microscopy and Photoluminescence I. Matko, B. Chenevier, J.M. Bluet, R. Madar, F. Letertre, W. Saikaly Trans Tech Publications	9 Conference Proceedings The Smart-Cut Process: Status and Developments Aspar, B., Lagahe, C., Moriceau, H., Jalaguier, E., Mas, A., Rayssac, O., Biasse, Soubie; B., Bruel, M., Auberton-Hevre, … Electrochemical Society
4 Conference Proceedings Metal Bonding in SiC Based Substrates Matko, I., Chenevier, B., Madar, R., Roussel, H., Coindeau, S., Letertre, F., Richtarch, C., Cioccio, L. Di Trans Tech Publications	10 Conference Proceedings Investigation of Structural Defects during 4H-SiC Schottky Diode Processing by Synchrotron Topography Pernot, E., Neyret, E., Moulin, C., Pernot-Rejmankova, P., Templier, F., Cioccio, L.Di., Billon, T., Madar, R. Trans Tech Publications
5 Conference Proceedings Smart Cut Technology: the path for advanced SOI substrates Moriceau, H., Lagahe-Blanchard, C., Fournel, F., Pocas, S., Jalaguier, E., Perreau, P., Deguet, C., Ernst, T., Beaumont, … Kluwer Academic Publishers	11 Conference Proceedings Investigation of Structural Defects during 4H-SiC Schottky Diode Processing by Synchrotron Topography Pernot, E., Neyret, E., Moulin, C., Pernot-Rejmankova, P., Templier, F., Di Cioccio, L., Billon, T., Madar, R. Trans Tech Publications
6 Conference Proceedings A New Process for the Fabrication of SiC Power Devices and Systems on SiCOI (Silicon Carbide On Insulator) Substrates Templier, Francois, Daval, Nicolas, Cioccio, Lea Di, Bourgeat, Daniel, Letertre, Fabrice, Planson, Dominique, Chante, … Materials Research Society	12 Conference Proceedings 3C-SiC Growth on 6H-SiC (0001) Substrates Matko, I., Chenevier, B., Audier, M., Madar, R., Diani, M., Simon, L., Kubler, L., Aubel, D. Trans Tech Publications

1

2

3

4

5

6

7

8

9

10

11

12