Blank Cover Image

Use of Infrared Thermal Imaging to Study Mold & Part Cooling

Author(s):
Publication title:
ANTEC 2004, 62nd annual technical conference, Chicago, IL, May 16-20, 2004
Title of ser.:
Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
Ser. no.:
62
Pub. Year:
2004
Page(from):
803
Page(to):
806
Pages:
4
Pub. info.:
Brookfield Center, Conn.: Society of Plastics Engineers
ISBN:
9780975370704 [0975370707]
Language:
English
Call no.:
S42700/62-1
Type:
Conference Proceedings

Similar Items:

Bozzelli, J.W.

Society of Plastics Engineers

Wu, Y. P., Bozzelli, J. W.

American Institute of Chemical Engineers

Chern, H.-T.S., Krasnoperov, L., Bozzelli, J.W.

American Institute of Chemical Engineers

Beck, W.A., Little, J.W., Goldberg, A.C., Faska, T.S.

Electrochemical Society

Bozzelli, J. W.

Society of Plastics Engineers, Inc. (SPE)

J. H. Wang, H. Z. Xu, L. Ma, X. Y. Wu, S. J. Yang

American Society of Mechanical Engineers

Bozzelli, J. W.

Society of Plastics Engineers, Inc. (SPE)

Hoffman,J.W.

SPIE-The International Society for Optical Engineering

Ing, W.-C., Bozzelli, J.W.

American Institute of Chemical Engineers

Kirch, Larry S., Magee, J.W., Stuper, W.W.

American Institute of Chemical Engineers

Bozzelli, J., Furches, B., Bujanowski, R., Little, J.

Society of Plastics Engineers, Inc. (SPE)

Dai, T., Pikkula, B.M., Tunnell, J.W., Chang, D.W., Anvari, B.

SPIE-The International Society for Optical Engineering

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12