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LAPLACE - A New Assembly Method using Laser Heating for Ultra Fine Pitch Devices

Author(s):
Teutsch, T. ( PacTech USA - Packaging Technologies, Inc. )
Blankenhorn, R. G.
Azdasht, G. ( PacTech - Packaging Technologies GmbH )
Penke, P.
Zakel, E.
Kim, J.-D. ( Samsung Techwin Co., Ltd. )
Kim, Y.-N.
Lee, J.-W.
Park, J.-H.
Kim, H.-G.
Kim, J.-O.
6 more
Publication title:
Proceedings, 2003 International Symposium on Microelectronics, November 18-20, 2003, Hynes Convention Center, Boston, Massa Massachusetts, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5288
Pub. Year:
2003
Page(from):
949
Page(to):
955
Pages:
7
Pub. info.:
Reston, Va.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819451897 [0819451894]
Language:
English
Call no.:
P63600/5288
Type:
Conference Proceedings

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