Flip Chip Bonding Technology for Molded Interconnect Device

Flip Chip Bonding Technology for Molded Interconnect Device

Author(s):

Yagi, Yoshihiko ( Matsushita Electric Industrial Col., Ltd. )

Harazono, Fumikazu ( Panasonic System Solutions Company )

2 more

Publication title:

Proceedings, 2003 International Symposium on Microelectronics, November 18-20, 2003, Hynes Convention Center, Boston, Massa Massachusetts, USA

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5288

Pub. Year:

2003

Page(from):

256

Page(to):

261

Pages:

6

Pub. info.:

Reston, Va.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819451897 [0819451894]

Language:

English

Call no.:

P63600/5288

Type:

Conference Proceedings

Details

TDL ID:	ZA00013172
Series ID:	PA00000029
Conf. info. (Name):	International Symposium on Microelectronics
Conf. info. (Number):	2003
Conf. info. (Venue):	Boston, MA, USA
Conf. info. (Date):	2003.11.18-2003.11.20

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