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Gold Ball Bonding on Copper Substrates at Ambient Temperatures

Author(s):
Publication title:
Proceedings, 2003 International Symposium on Microelectronics, November 18-20, 2003, Hynes Convention Center, Boston, Massa Massachusetts, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5288
Pub. Year:
2003
Page(from):
130
Page(to):
135
Pages:
6
Pub. info.:
Reston, Va.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819451897 [0819451894]
Language:
English
Call no.:
P63600/5288
Type:
Conference Proceedings

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