Through-pellicle-capable DUV-based CD metrology on reticles for wafer fab and R&D environment

Through-pellicle-capable DUV-based CD metrology on reticles for wafer fab and R&D environment

Author(s):

Jonckheere, R.M. ( IMEC vzw (Belgium) )

Philipsen, V. ( IMEC vzw (Belgium) )

Scheuring, G. ( MueTec GmbH (Germany) )

Hillmann, F. ( MueTec GmbH (Germany) )

Brueck, H.-J. ( MueTec GmbH (Germany) )

Ordynskyy, V. ( PDF Solutions GmbH (Germany) )

Peter, K. ( PDF Solutions GmbH (Germany) )

Hourd, A.C. ( Compugraphics International Ltd. (United Kingdom) )

Schaetz, T. ( Infineon Technologies AG (Germany) )

Chen, S.-B. ( Taiwan Mask Corp. (Taiwan) )

Chen, P.W. ( Taiwan Mask Corp. (Taiwan) )

Sommer, K. ( Karl Sommer Consulting (Germany) )

7 more

Publication title:

19th European Conference on Mask Technology for Integrated Circuits and Microcomponents

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5148

Pub. Year:

2003

Page(from):

158

Page(to):

168

Pages:

11

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819450180 [0819450189]

Language:

English

Call no.:

P63600/5148

Type:

Conference Proceedings

Details

TDL ID:	ZA00013133
Series ID:	PA00000029
Conf. info. (Name):	European Mask and Lithography Conference : European Conference on Mask Technology for Integrated Circuits and Microcomponents
Conf. info. (Number):	2003 : 19th
Conf. info. (Venue):	Sonthofen, Germany
Conf. info. (Date):	2003.01.13-2003.01.15

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