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Simulation of void formation in interconnect lines

Author(s):
Publication title:
VLSI Circuits and Systems
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5117
Pub. Year:
2003
Page(from):
445
Page(to):
452
Pages:
8
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819449771 [0819449776]
Language:
English
Call no.:
P63600/5117
Type:
Conference Proceedings

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