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Characterization of front- to backwafer alignment and bulk micromachining using electrical overlay test structures

Author(s):
Publication title:
Smart Sensors, Actuators, and MEMS
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5116
Pub. Year:
2003
Vol.:
2
Pt.:
Session 10
Page(from):
617
Page(to):
626
Pages:
10
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819449764 [0819449768]
Language:
English
Call no.:
P63600/5116
Type:
Conference Proceedings

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