Imaging the microstructure of copper with the atomic force microscope (AFM) and ultrasonic force microscope (UFM)

Imaging the microstructure of copper with the atomic force microscope (AFM) and ultrasonic force microscope (UFM)

Author(s):

Druffner, C.J. ( Univ. of Dayton Research Institute (USA) )
Schumaker, E.J. ( Univ. of Dayton Research Institute (USA) )
Murray, P.T. ( Univ. of Dayton Research Institute (USA) )
Sathish, S. ( Univ. of Dayton Research Institute (USA) )

Publication title:

Testing, Reliability, and Application of Micro- and Nano-Material Systems

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5045

Pub. Year:

2003

Page(from):

122

Page(to):

131

Pages:

10

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819448507 [0819448508]

Language:

English

Call no.:

P63600/5045

Type:

Conference Proceedings

Details

TDL ID:	ZA00013036
Series ID:	PA00000029
Conf. info. (Name):	Smart Structures : Testing, Reliability, and Application of Micro-and Nano-Material Systems
Conf. info. (Number):	2003
Conf. info. (Venue):	San Diego, CA, USA
Conf. info. (Date):	2003.03.03-2003.03.05

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