Failure prediction across process window for robust OPC

Failure prediction across process window for robust OPC

Author(s):

Shang, S.D. ( Menthor Graphics Corp. (USA) )

Granik, Y.

Cobb, N.B.

Maurer, W.

Cui, Y. ( IBM Corp. (USA) )

Liebmann, L.W.

Oberschmidt, J.M.

Singh, R.N. ( IBM Thomas J. Watson Research Ctr. (USA) )

Vampatella, B.R. ( IBM Corp. (USA) )

4 more

Publication title:

Design and process integration for microelectronic manufacturing II : 26-28 February 2003, Santa Clara, California, USA

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5042

Pub. Year:

2003

Page(from):

376

Page(to):

385

Pages:

10

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819448477 [0819448478]

Language:

English

Call no.:

P63600/5042

Type:

Conference Proceedings

Details

TDL ID:	ZA00013033
Series ID:	PA00000029
Conf. info. (Name):	Microelectronic Manufacturing : Design and process integration for microelectronic manufacturing
Conf. info. (Number):	2003 : 2nd
Conf. info. (Venue):	Santa Clara, CA, USA
Conf. info. (Date):	2003.02.26-2003.02.28

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