Impact of scattering bars in damascene trench patterning
- Author(s):
- Mehta, S.S. ( Institute of Microelectronics (Singapore) )
- Singh, N. ( Institute of Microelectronics (Singapore) )
- Mukherjee-Roy, M. ( Institute of Microelectronics (Singapore) )
- Kumar, R. ( Institute of Microelectronics (Singapore) )
- Publication title:
- Optical Microlithography XVI
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 5040
- Pub. Year:
- 2003
- Vol.:
- Part Two
- Page(from):
- 967
- Page(to):
- 971
- Pages:
- 5
- Pub. info.:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819448453 [0819448451]
- Language:
- English
- Call no.:
- P63600/5040
- Type:
- Conference Proceedings
Similar Items:
SPIE - The International Society of Optical Engineering |
7
Conference Proceedings
Effect of feature size, pitch, and resist sensitivity on side-lobe and ring formation for via hole patterning in attenuated phase-shift masks
SPIE-The International Society for Optical Engineering |
SPIE - The International Society of Optical Engineering |
8
Conference Proceedings
Effect of developer surfactant on lithography process latitudes and post pattern defect concentration
SPIE-The International Society for Optical Engineering |
3
Conference Proceedings
Evaluation of alignment target designs for Cu and low-K dual damascene processes
SPIE-The International Society for Optical Engineering |
Trans Tech Publications |
SPIE - The International Society of Optical Engineering |
10
Conference Proceedings
Evaluation of Mechanical Properties of PEEK HAp Bio-Composite Used in Load Bearing Bone Implants
Trans Tech Publications |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
6
Conference Proceedings
Evaluation of overlay measurement target designs for Cu dual-damascene process
SPIE-The International Society for Optical Engineering |
12
Conference Proceedings
Developer-soluble gap fill materials for patterning metal trenches in via-first dual-damascene process
SPIE - The International Society of Optical Engineering |