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Most feasible curing process for ArF resists in device integration aspect

Author(s):
Kim, H.-W. ( Samsung Electronics Co., Ltd. (South Korea) )
Kang, Y. ( Samsung Electronics Co., Ltd. (South Korea) )
Lee, J.-H. ( Samsung Electronics Co., Ltd. (South Korea) )
Chae, Y.-S. ( Samsung Electronics Co., Ltd. (South Korea) )
Woo, S.-G. ( Samsung Electronics Co., Ltd. (South Korea) )
Cho, H.-K. ( Samsung Electronics Co., Ltd. (South Korea) )
Han, W.-S. ( Samsung Electronics Co., Ltd. (South Korea) )
2 more
Publication title:
Advances in Resist Technology and Processing XX
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5039
Pub. Year:
2003
Vol.:
2
Pt.:
Poster Session
Page(from):
817
Page(to):
826
Pages:
10
Pub. info.:
Bellingham, CA: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819448446 [0819448443]
Language:
English
Call no.:
P63600/5039
Type:
Conference Proceedings

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