Impact of thin resist processes on post-etch LER

Impact of thin resist processes on post-etch LER

Author(s):

Mahorowala, A.P. ( IBM Thomas J. Watson Research Ctr. (USA) )

Goldfarb, D.L. ( IBM Thomas J. Watson Research Ctr. (USA) )

Temple, K. ( IBM Thomas J. Watson Research Ctr. (USA) )

Petrillo, K.E. ( IBM Thomas J. Watson Research Ctr. (USA) )

Pfeiffer, D. ( IBM Thomas J. Watson Research Ctr. (USA) )

Babich, K. ( IBM Thomas J. Watson Research Ctr. (USA) )

Angelopoulos, M. ( IBM Thomas J. Watson Research Ctr. (USA) )

Gallatin, G.M. ( IBM Thomas J. Watson Research Ctr. (USA) )

Rasgon, S. ( Massachusetts Institute of Technology (USA) )

Sawin, H.H. ( Massachusetts Institute of Technology (USA) )

Allen, S.D. ( IBM Microelectronics Div. (USA) )

Lang, R.N. ( IBM Microelectronics Div. (USA) )

Lawson, M.C. ( IBM Microelectronics Div. (USA) )

Kwong, R.W. ( IBM Microelectronics Div. (USA) )

Chen, K.-J. ( IBM Microelectronics Div. (USA) )

Li, W. ( IBM Microelectronics Div. (USA) )

Varanasi, P.R. ( IBM Microelectronics Div. (USA) )

Sanchez, M.I. ( IBM Almaden Research Ctr. (USA) )

Ito, H. ( IBM Almaden Research Ctr. (USA) )

Wallraff, G.M. ( IBM Almaden Research Ctr. (USA) )

Allen, R.D. ( IBM Almaden Research Ctr. (USA) )

16 more

Publication title:

Advances in Resist Technology and Processing XX

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5039

Pub. Year:

2003

Vol.:

1

Pt.:

Session 5

Page(from):

213

Page(to):

224

Pages:

12

Pub. info.:

Bellingham, CA: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819448446 [0819448443]

Language:

English

Call no.:

P63600/5039

Type:

Conference Proceedings

Details

TDL ID:	ZA00013027
Series ID:	PA00000029
Conf. info. (Name):	SPIE Advanced Lithography : Advances in Resist Technology and Processing
Conf. info. (Number):	2003 : 20th
Conf. info. (Venue):	Santa Clara, CA
Conf. info. (Date):	2003.02.24-2003.02.26
Note for article:	Session 5. Materials for 193-nm Resists ; 5039-23

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