New method for the quantitative evaluation of wafer pattern shape based on CAD data

New method for the quantitative evaluation of wafer pattern shape based on CAD data

Author(s):

Matsuoka, R. ( Seiko Instruments Inc. (Japan) )
Takahashi, M. ( Seiko Instruments Inc. (Japan) )
Uemoto, A. ( Seiko Instruments Inc. (Japan) )

Publication title:

Metrology, Inspection, and Process Control for Microlithography XVII

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5038

Pub. Year:

2003

Vol.:

1

Page(from):

540

Page(to):

546

Pages:

7

Pub. info.:

Bellingham, WA: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819448439 [0819448435]

Language:

English

Call no.:

P63600/5038

Type:

Conference Proceedings

Details

TDL ID:	ZA00013025
Series ID:	PA00000029
Conf. info. (Name):	SPIE Advanced Lithography : Metrology, Inspection, and Process Control for Microlithography
Conf. info. (Number):	2003 : 17th
Conf. info. (Venue):	Santa Clara, California, USA
Conf. info. (Date):	2003.02.24-2003.02.27
Note for article:	Critical Dimension Metrology II ; 5038-55

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