Mix and match capability of e-beam direct-write for the 65-nm technology

Mix and match capability of e-beam direct-write for the 65-nm technology

Author(s):

Laplanche, Y. ( STMicroelectronics (France) )

Charpin, M. ( CEA-LETI (France) )

Pain, L. ( CEA-LETI (France) )

Todeschini, J. ( Philips Semiconductors (France) )

Henry, D. ( STMicroelectronics (France) )

Sassoulas, P.-O. ( STMicroelectronics (France) )

Gough, S. ( STMicroelectronics (France) )

Weidenmueller, U. ( Leica Microsystems Lithography GmbH (Germany) )

Hahmann, P. ( Leica Microsystems Lithography GmbH (Germany) )

4 more

Publication title:

Emerging Lithographic Technologies VII

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5037

Pub. Year:

2003

Vol.:

1

Pt.:

Session 15

Page(from):

572

Page(to):

582

Pages:

11

Pub. info.:

Bellingham, WA: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819448422 [0819448427]

Language:

English

Call no.:

P63600/5037

Type:

Conference Proceedings

Details

TDL ID:	ZA00013023
Series ID:	PA00000029
Conf. info. (Name):	SPIE Advanced Lithography : Emerging Lithographic Technologies
Conf. info. (Number):	2003 : 7th
Conf. info. (Venue):	Santa Clara, California, USA
Conf. info. (Date):	2003.02.25-2003.02.27
Note for article:	Session 15. E-Beam Direct Write/Maskless ; 5037-72

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