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Hybrid integration of III-V optoelectronic devices on Si platform using BCB

Author(s):
Publication title:
Photonics Packaging and Integration III
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4997
Pub. date:
2003
Page(from):
198
Page(to):
205
Pages:
8
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819447975 [0819447978]
Language:
English
Call no.:
P63600/4997
Type:
Conference Proceedings

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