Flip-chip bonded optoelectronic integration based on ultrathin silicon (UTSi) CMOS

Flip-chip bonded optoelectronic integration based on ultrathin silicon (UTSi) CMOS

Author(s):

Hong, S. ( Univ. of Southern California (USA) )
Ho, T. ( Univ. of Southern California (USA) )
Zhang, L. ( Univ. of Southern California (USA) )
Sawchuk, A.A. ( Univ. of Southern California (USA) )

Publication title:

Photonics Packaging and Integration III

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4997

Pub. Year:

2003

Page(from):

127

Page(to):

134

Pages:

8

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819447975 [0819447978]

Language:

English

Call no.:

P63600/4997

Type:

Conference Proceedings

Details

TDL ID:	ZA00012980
Series ID:	PA00000029
Conf. info. (Name):	Photonics West - Optoelectronic Materials and Devices : Photonics packaging and integration
Conf. info. (Number):	2003 : 3rd
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	2003.01.28-2003.01.30

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