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Finite difference analysis of thermal characteristics of CW operation 850-nm lateral current injection and implant-apertured VCSEL with flip-chip bond design

Author(s):
Mehandru, R. ( Univ. of Florida (USA) )
Dang, G. ( Univ. of Florida (USA) )
Ip, K.P. ( Univ. of Florida (USA) )
Kim, S. ( Univ. of Florida (USA) )
Ren, F. ( Univ. of Florida (USA) )
Pearton, S.J. ( Univ. of Florida (USA) )
Hobson, W.S. ( Multiplex, Inc. (USA) )
Lopata, J. ( Multiplex, Inc. (USA) )
Chang, W.H. ( U.S. Army Research Lab. (USA) )
Shen, H. ( U.S. Army Research Lab. (USA) )
5 more
Publication title:
Physics and Simulation of Optoelectronic Devices XI
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4986
Pub. date:
2003
Page(from):
323
Page(to):
331
Pages:
9
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819447869 [0819447862]
Language:
English
Call no.:
P63600/4986
Type:
Conference Proceedings

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