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3-D, Self-aligned, Micro-assembled, Electrical Interconnects for Heterogeneous Integration

Author(s):
Huang, T. ( Zyvex Corp. (USA) )
Nilsen, E. ( Zyvex Corp. (USA) )
Ellis, M. ( Zyvex Corp. (USA) )
Kim, K. ( Zyvex Corp. (USA) )
Tsui, K. ( Zyvex Corp. (USA) )
Skidmore, G.D. ( Zyvex Corp. (USA) )
Goldsmith, C. ( MEMtronics Corp. (USA) )
Nallani, A. ( Univ. of Texas/Dallas (USA) )
Lee, J.B. ( Univ. of Texas/Dallas (USA) )
4 more
Publication title:
MEMS Components and Applications for Industry, Automobiles, Aerospace, and Communication II
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4981
Pub. Year:
2003
Page(from):
189
Page(to):
201
Pages:
13
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819447814 [0819447811]
Language:
English
Call no.:
P63600/4981
Type:
Conference Proceedings

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