Ablation processing of biomedical materials by ultrashort laser pulse ranging from 50 fs through 2 ps

Ablation processing of biomedical materials by ultrashort laser pulse ranging from 50 fs through 2 ps

Author(s):

Ozono, K. ( Keio Univ. (Japan) )
Obara, M. ( Keio Univ. (Japan) )
Sakuma, J. ( Cyber Laser Inc. (Japan) )

Publication title:

Commercial and biomedical applications of ultrafast lasers III : 28-30 January 2003, San Jose, California, USA

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4978

Pub. Year:

2003

Page(from):

208

Page(to):

213

Pages:

6

Pub. info.:

Bellingham, Wash., USA: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819447784 [0819447781]

Language:

English

Call no.:

P63600/4978

Type:

Conference Proceedings

Details

TDL ID:	ZA00012962
Series ID:	PA00000029
Conf. info. (Name):	SPIE LASE : Commercial and Biomedical Applications of Ultrafast Lasers
Conf. info. (Number):	2003 : 3rd
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	2003.01.28-2003.01.30

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