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Thermal strain analysis for flip chip packaging

Author(s):
  • Zhong, Z.W. ( Nanyang Technological Univ. (Singapore) )
  • Lee, S.G. ( Nanyang Technological Univ. (Singapore) )
Publication title:
MEMS/MOEMS: Advances in Photonic Communications, Sensing, Metrology, Packaging and Assembly
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4945
Pub. Year:
2003
Page(from):
138
Page(to):
145
Pages:
8
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819447401 [0819447404]
Language:
English
Call no.:
P63600/4945
Type:
Conference Proceedings

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