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Three-Dimensional Simulation of Wire Sweep During Semiconductor-Chip Encapsulation

Author(s):
Publication title:
ANTEC 2003, annual technical conference, May 4-8, Nashville, Tennessee
Title of ser.:
Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
Ser. no.:
61
Pub. Year:
2003
Page(from):
1310
Page(to):
1314
Pages:
5
Pub. info.:
Brookfield Center, Conn.: Society of Plastics Engineers
ISBN:
9780972718011 [097271801X]
Language:
English
Call no.:
S42700/61-2
Type:
Conference Proceedings

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