On scaling the thin film Si thickness of SOI substrates. A Perspective on Wafer Bonding for Thin Film Devices

On scaling the thin film Si thickness of SOI substrates. A Perspective on Wafer Bonding for Thin Film Devices

Author(s):

Publication title:

Progress in SOI structures and devices operating at extreme conditions

Title of ser.:

NATO science series. Series 2, Mathematics, physics and chemistry

Ser. no.:

58

Pub. Year:

2002

Page(from):

299

Page(to):

308

Pages:

10

Pub. info.:

Dordrecht: Kluwer Academic Publishers

ISBN:

9781402005756 [140200575X]

Language:

English

Call no.:

N17050/58

Type:

Conference Proceedings

Details

TDL ID:	ZA00012854
Series ID:	PA00000025
Conf. info. (Name):	NATO advanced research workshop on progress in SOI structures and devices operating at extreme conditions
Conf. info. (Number):	2000
Conf. info. (Venue):	Kyiv, Ukraine
Conf. info. (Date):	2000.10.15-2000.10.20

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