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On scaling the thin film Si thickness of SOI substrates. A Perspective on Wafer Bonding for Thin Film Devices

Author(s):
Publication title:
Progress in SOI structures and devices operating at extreme conditions
Title of ser.:
NATO science series. Series 2, Mathematics, physics and chemistry
Ser. no.:
58
Pub. date:
2002
Page(from):
299
Page(to):
308
Pages:
10
Pub. info.:
Dordrecht: Kluwer Academic Publishers
ISBN:
9781402005756 [140200575X]
Language:
English
Call no.:
N17050/58
Type:
Conference Proceedings

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