Ultra-high-density Interconnection Technology of 3-dimensional Packaging

Ultra-high-density Interconnection Technology of 3-dimensional Packaging

Author(s):

Takahashi, Kenji ( ASET-Association of Super-Advanced Electronics Technologies )

Publication title:

Proceedings : 2002 International Symposium on Microelectronics : September 4-6, 2002, Colorado Convention Center, Denver, CO

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4931

Pub. Year:

2002

Page(from):

354

Page(to):

359

Pages:

6

Pub. info.:

Washington, DC: IMAPS

ISSN:

0277786X

ISBN:

9780930815660 [0930815661]

Language:

English

Call no.:

P63600/4931

Type:

Conference Proceedings

Details

TDL ID:	ZA00012780
Series ID:	PA00000029
Conf. info. (Name):	International Symposium on Microelectronics
Conf. info. (Number):	2002
Conf. info. (Venue):	Denver, CO, USA
Conf. info. (Date):	2002.09.04-2002.09.06

Similar Items:

1 Conference Proceedings 3-Dimensional Chip Stacking for High-Density Electronic Packaging Takahashi, K., Tanida, K., Umemoto, M., Kojiama, K., Ishino, M., Bonkohara, M. Electrochemical Society	7 Conference Proceedings Z-Axis Interconnection for 3-D High Density Packaging Spiesshoefer, S., Schaper, L., Maner, K., Porter, E., Barlow, F., Grover, M., Marsh, W., Bates, G., Lucas, M. IMAPS
2 Conference Proceedings High Density Packaging Technology Research & Development Roadmap in Japan Bonkohara, Manabu IMAPS	8 Conference Proceedings Development of ultra thin three-dimensional image capturing system [6056-32] Yamada K., Mitsui H., Tanida J., Takahashi H. SPIE - The International Society of Optical Engineering
3 Conference Proceedings Ultra-Thin & High-Density Packaging Using Both Sides Filip Chip Technology Nishida, Kazuto, Shimiz, Kazumichi, Yoshino, Michiro, Yagi, Yoshihiko, Koguchi, Hideo, Sasaki, Chie IMAPS	9 Conference Proceedings MEASURING METHODS FOR HIGH-POWER CHARACTERISTICS OF PIEZOELECTRIC MATERIALS Hirose, Seiji, Takahashi, Sadayuki, Uchino, Kenji, Aoyagi, Manabu, Tomikawa, Yoshiro MRS - Materials Research Society
4 Conference Proceedings Current and Future Three-Dimensional LSI Integration Technology by Manabu Bonkohara, Makoto Motoyoshi, Kazutoshi Kamibayashi, Mitsumasa Koyanagi Materials Research Society	10 Conference Proceedings Vertically High Density Interconnection for Mobile Application Katahira, Takayoshi, Kartio, Ilkka, Segawa, Hiroshi, Takahashi, Michimasa, Sagisaka, Katsumi SPIE-The International Society for Optical Engineering
5 Conference Proceedings Development of a Novel Si/Si Interconnection Technology for High Density Packaging Khanna,P.K., Bhatnagar,S.K., Sommadossi,S., Gust,W., Mittemeijer,E J. SPIE - The International Society for Optical Engineering	11 Conference Proceedings High Reliability Interconnection Technology using Conductive Adhesive Mitani,Tsutomu, Takezawa,Hiroaki, Ishimaru,Yukihiro, Kitae,Takashi, Itagaki,Minehiro, Bessho,Yoshihiro IMAPS
6 Conference Proceedings Current and Future 3D-LSI Technology for the Image Sensor Devices Makoto Motoyoshi, Hirofumi Nakamura, Manabu Bonkohara, Mitsumasa Koyanagi Materials Research Society	12 Conference Proceedings Development of 3-D Packaging Process Technology for Stacked Memory Chips Toshiro Mitsuhashi, Yoshimi Egawa, Osamu Kato, Yoshihiro Saeki, Hidekazu Kikuchi, Shiro Uchiyama, Kayoko Shibata, Junji … Materials Research Society

1

2

3

4

5

6

7

8

9

10

11

12