Blank Cover Image

High Density Packaging Technology Research & Development Roadmap in Japan

Author(s):
Bonkohara, Manabu ( ASET-Association of SuperAdvanced Electronics Technologies )  
Publication title:
Proceedings : 2002 International Symposium on Microelectronics : September 4-6, 2002, Colorado Convention Center, Denver, CO
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4931
Pub. Year:
2002
Page(from):
336
Page(to):
341
Pages:
6
Pub. info.:
Washington, DC: IMAPS
ISSN:
0277786X
ISBN:
9780930815660 [0930815661]
Language:
English
Call no.:
P63600/4931
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Ultra-high-density Interconnection Technology of 3-dimensional Packaging

Takahashi, Kenji, Umemoto, Mitsuo, Tanida, Kazumasa, Nemoto, Yoshihiko, Tomita, Yoshihiro, Tago, Masamoto, Bonkohara, …

IMAPS
7 Conference Proceedings Active interposer technology for high-speed and low-cost chip-to-chip optical interconnects (Invited Paper)

Mikawa, T., Ibaragi, O., Bonkohara, M.

SPIE-The International Society for Optical Engineering
2 Conference Proceedings 3-Dimensional Chip Stacking for High-Density Electronic Packaging

Takahashi, K., Tanida, K., Umemoto, M., Kojiama, K., Ishino, M., Bonkohara, M.

Electrochemical Society
8 Conference Proceedings Roadmap for Research, Development, and Demonstration of Instrumentation, Controls, and Human-Machine Interface Technologies

Don W. Miller, Steven A. Arndt, Leonard J. Bond, Donald D. Dudenhoeffer, Bruce P. Hallbert, David E. Holcomb, Richard T. …

American Society of Mechanical Engineers
3 Conference Proceedings Development of a Novel Si/Si Interconnection Technology for High Density Packaging

Khanna,P.K., Bhatnagar,S.K., Sommadossi,S., Gust,W., Mittemeijer,E J.

SPIE - The International Society for Optical Engineering
9 Conference Proceedings Technology Roadmap: Process Development

Fernando J. Muzzio

American Institute of Chemical Engineers
4 Conference Proceedings Current and Future Three-Dimensional LSI Integration Technology by

Manabu Bonkohara, Makoto Motoyoshi, Kazutoshi Kamibayashi, Mitsumasa Koyanagi

Materials Research Society
10 Conference Proceedings Technology Roadmap: Context and Drivers for Roadmap Development

Prabir K. Basu

American Institute of Chemical Engineers
5 Conference Proceedings Current and Future 3D-LSI Technology for the Image Sensor Devices

Makoto Motoyoshi, Hirofumi Nakamura, Manabu Bonkohara, Mitsumasa Koyanagi

Materials Research Society
11 Conference Proceedings Packaging roadmap

de Saint Roman, D.

ESA Publications Division
6 Conference Proceedings MCM Development Using Fine Pitch Ball Bump

Dohya, Akihiro, Morisaki, Ikushi, Bonkohara, Manabu, Nakamura, Hirofumi

MRS - Materials Research Society
12 Conference Proceedings Development of New High-Mounting Density Packages

Kasai, J., Tsuji, K., Yoneda, Y.

MRS - Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12