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Phase Transformation and Residual Stress Evolution in Electroless Ni-P UBM used in Low Cost Flip Chip Technology

Author(s):
Publication title:
Proceedings : 2002 International Symposium on Microelectronics : September 4-6, 2002, Colorado Convention Center, Denver, CO
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4931
Pub. Year:
2002
Page(from):
261
Page(to):
266
Pages:
6
Pub. info.:
Washington, DC: IMAPS
ISSN:
0277786X
ISBN:
9780930815660 [0930815661]
Language:
English
Call no.:
P63600/4931
Type:
Conference Proceedings

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