Example of simultaneous alignment, packaging, and interconnection of MEMS stacks

Example of simultaneous alignment, packaging, and interconnection of MEMS stacks

Author(s):

Gross, H.S. ( Optic Net, Inc. (USA) )
Ton, D ( Santur Corp. (USA) )
Gmuer, M. ( Weidmann Plastics Technology A.G. (Switzerland) )
Crewe, D.A. ( Applied Materials, Inc. (USA) )

Publication title:

Design, test, integration, and packaging of MEMS/MOEMS 2002 : 6-8 May, 2002, Cannes, France

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4755

Pub. Year:

2002

Page(from):

680

Page(to):

688

Pages:

9

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819445186 [0819445185]

Language:

English

Call no.:

P63600/4755

Type:

Conference Proceedings

Details

TDL ID:	ZA00012592
Series ID:	PA00000029
Conf. info. (Name):	Design, test, integration, and packaging of MEMS/MOEMS
Conf. info. (Number):	2002
Conf. info. (Venue):	Cannes, France
Conf. info. (Date):	2002.05.06-2002.05.08

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