Integration of a network solver and a field solver for the mixed level thermal simulation of MEMS problems
- Author(s):
- Rencz, M. ( MicReD Ltd. (Hungary) )
- Szekely, V. ( Budapest Univ. of Technology and Economics (Hungary) )
- Poppe, A. ( MicReD Ltd. (Hungary) )
- Publication title:
- Design, test, integration, and packaging of MEMS/MOEMS 2002 : 6-8 May, 2002, Cannes, France
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 4755
- Pub. Year:
- 2002
- Page(from):
- 36
- Page(to):
- 43
- Pages:
- 8
- Pub. info.:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819445186 [0819445185]
- Language:
- English
- Call no.:
- P63600/4755
- Type:
- Conference Proceedings
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